Facilities
Get to know our team and all the contributors
that push us forward
INESC Microsistemas e Nanotecnologias
INESC MN operates a 200 m² cleanroom (class 10/100 areas) and adjoining 200 m² grey area (class 10,000). The technology infrastructure includes an additional 170 m² area of laboratory space.
Cleanroom
Lithography
Deposition
Etching
- Lithography
The microfabrication lithography suite is equipped with a range of advanced techniques for precise patterning and device fabrication, from fast design and exposure optimization for pattern development to exposure of pre-production batches.
The techniques available comprise photo and electron beam lithography, from micrometer to nanoscale resolutions, using direct write or hard mask assisted exposure.
Resist coating and development processes ensure uniform application and precise development of a varied range of resists, integral to defining micro-scale features.
OUR EQUIPMENT
Laser writer Heidelberg Instruments DWLii +info
- Electron beam system RAITH 150
Mask aligner Karl Suss MA/BA6 +info
- Mask aligner KLOÉ UV-KUB 2
- Resist coater & developer track SVG 88
- Semi-automated resist coater & developer SPS
- Wafer washer Semitool PSC-101
- Etching
The etching lab offers a range of advanced techniques for precise material removal and surface patterning (up to 200 mm wafers).
Dry etching systems include reactive ion etching (RIE) and ion beam etching (IBE), while wet etch processing is also available.
Additionally, tools for UV and oxygen plasma surface cleaning are available, including a plasma ashing equipment compatible with 200 mm wafer batches.
OUR EQUIPMENT
SPTS Omega ICP (RIE) +info
This system uses reactive ion etching to etch dielectrics and metals using fluorine and chlorine chemistry. It is design to process up to 200 mm diameter wafers. The samples processed on the equipment have an uniformity of +/- 2.5 %. The system has 8 gases available: Ar, CF4, SF6, HBr, Cl2, BCl3, O2 and H2.
- LAM Research Rainbow (RIE)
- Nordiko 3000 (IBE)
- Nordiko 3600 cluster tool (IBE)
- Nordiko 7000 (soft sputter etching)
- Batch asher PVA Tepla GIGAbatch380M
- Deposition
The deposition suite is equipped with a comprehensive array of techniques for thin film deposition, supporting advanced material development and microfabrication applications.
Deposition systems include magnetron sputtering, ion beam deposition (IBD) and plasma-enhanced chemical vapor deposition (PECVD), including more than 29 sputter targets available simultaneously in the sputtering machines (single and multitarget configurations).
The machines enable deposition of thin films from 0.3 nm up to several micrometers, with good uniformities across (up to) 200mm wafer diameter. Several substrate sizes and thickness and type are possible (glass, silicon, flexible coatings).
OUR EQUIPMENT
- Nordiko 2000 (Magnetron/RF sputtering)
- Nordiko 3000 (IBD)
Nordiko 3600 cluster tool (IBD) +info
Ion beam deposition of metals and dielectrics on up to 8 inch wafers. The system has 6 targets to deposit multilayer structures with precise and automatic control of film thickness. Typical structures are spin valves and tunnel junctions, read gap oxides, passivation layers. Base pressure 5x10-8 Torr.
- Nordiko 7000 (Magnetron sputtering)
Nordiko 8800 (Magnetron sputtering) +info
Multi-target magnetron deposition system (up to 8" wafers). Available 8 targets (e.g. CoFe, CoFeB, NiFe, MgO, MnPt, FeB, Cr, Co, Ru).
- UHVI - Metallic single target
- UHVII - Oxide single target
- Alcatel multitarget
Oxford Plasma Pro 100 (PECVD) +info
- Aixtron NanoInstruments Black Magic (PECVD)
- Yield Engineering YES 15 HMDS (Vapor priming)
Lithography
The microfabrication lithography suite is equipped with a range of advanced techniques for precise patterning and device fabrication, from fast design and exposure optimization for pattern development to exposure of pre-production batches.
The techniques available comprise photo and electron beam lithography, from micrometer to nanoscale resolutions, using direct write or hard mask assisted exposure.
Resist coating and development processes ensure uniform application and precise development of a varied range of resists, integral to defining micro-scale features.
OUR EQUIPMENT
- Laser writer Heidelberg Instruments DWLii
- Electron beam system RAITH 150
- Mask aligner Karl Suss MA/BA6
- Mask aligner KLOÉ UV-KUB 2
- Resist coater & developer track SVG 88
- Semi-automated resist coater & developer SPS
- Wafer washer Semitool PSC-101
Etching
The etching lab offers a range of advanced techniques for precise material removal and surface patterning (up to 200 mm wafers).
Dry etching systems include reactive ion etching (RIE) and ion beam etching (IBE), while wet etch processing is also available.
Additionally, tools for UV and oxygen plasma surface cleaning are available, including a plasma ashing equipment compatible with 200 mm wafer batches.
OUR EQUIPMENT
SPTS Omega ICP (RIE) +info
This system uses reactive ion etching to etch dielectrics and metals using fluorine and chlorine chemistry. It is design to process up to 200 mm diameter wafers. The samples processed on the equipment have an uniformity of +/- 2.5 %. The system has 8 gases available: Ar, CF4, SF6, HBr, Cl2, BCl3, O2 and H2.
- LAM Research Rainbow (RIE)
- Nordiko 3000 (IBE)
- Nordiko 3600 cluster tool (IBE)
- Nordiko 7000 (soft sputter etching)
- Batch asher PVA Tepla GIGAbatch380M
Deposition
The deposition suite is equipped with a comprehensive array of techniques for thin film deposition, supporting advanced material development and microfabrication applications.
Deposition systems include magnetron sputtering, ion beam deposition (IBD) and plasma-enhanced chemical vapor deposition (PECVD), including more than 29 sputter targets available simultaneously in the sputtering machines (single and multitarget configurations).
The machines enable deposition of thin films from 0.3 nm up to several micrometers, with good uniformities across (up to) 200mm wafer diameter. Several substrate sizes and thickness and type are possible (glass, silicon, flexible coatings).
OUR EQUIPMENT
- Nordiko 2000 (Magnetron/RF sputtering)
- Nordiko 3000 (IBD)
Nordiko 3600 cluster tool (IBD) +info
- Nordiko 7000 (Magnetron sputtering)
Nordiko 8800 (Magnetron sputtering) +info
Multi-target magnetron deposition system (up to 8" wafers). Available 8 targets (e.g. CoFe, CoFeB, NiFe, MgO, MnPt, FeB, Cr, Co, Ru).
- UHVI - Metallic single target
- UHVII - Oxide single target
- Alcatel multitarget
- Oxford Plasma Pro 100 (PECVD)
- Aixtron NanoInstruments Black Magic (PECVD)
- Yield Engineering YES 15 HMDS (Vapor priming)
Tools
Characterization
Micromachining
Microfluidics
Microelectronics
Photonics &
Optoelectronics
Bioanalytical
- Characterization
Our labs are equipped with a variety of characterization tools, from material deposition levels to microfabricated devices, supporting quality control of microfabrication processes as well as qualification of materials and devices for both fundamental research and industrial applications.
OUR EQUIPMENT
- Profilometer Dektak-XT Advanced system
- Profilometer (Tencor Alpha-step 200)
- Ellipsometer Semilab SE-2000
- SEM RAITH 150
- Resistivity mapper CMT-SR2000N - AIT
- VSM DMS880
- VSM Microsense EZ7
- X-ray difractometer Siemens D5000
- Magnetoresistance measurement setups: 150Oe, 2KOe probers and Autoprober
- Noise spectrum analyzer
- Vacuum annealing oven with magnetic field
- Photonics & Optoelectronics
The optoelectronics lab is equipped for optoelectronic and micromechanical device characterization: a 500 MHz scalar network analyzer, a 1 GHz spectral analyzer, a 2-phase 100 kHz lock-in amplifier and two 1-phase 100 kHz lock-in amplifiers.
We have two picoammeters for low-speed, high sensitivity measurements. The lab also has a monochromator with reticles for 400-1600 nm optical measurements, a tungsten halogen and an arc-lamp light source.
The lab has optical tables, a large assortment of power supplies and optical accessories. Measurements can be performed in vacuum or at controlled pressures.
In the photonics lab we perform forward and inverse photonic design based on finite-difference time-domain and frequency-domain solvers to support the micro and nanofabrication of photonic devices, in particular, metasurfaces. The structured light laboratory enables device characterization (modal analysis decomposition of the shaped optical beams), comprising laser sources (visible and near-infrared), a reprogrammable spatial light modulator, cameras for beam detection, and a variety of optical and optomechanics components.
OUR EQUIPMENT
- Lock-in amplifiers 5209 EG&G Pricenton Applied Research
- Lock-in amplifier SR830 DSP Stanford Research System
- Picoammeters Keithley 237 & 487
- Monochromator Oriel 77250
- 500MHz network analyzer, 4195A Hewlett Packard
- GHz spectral analyzer N9320B - Agilent
- Microfluidics
The microfluidics lab focuses its activities in the design, simulation, fabrication and test of microfluidic devices and organs-on-chip, including heterogeneous integration (different materials and thin film sensors/actuators microfabricated in-house).
Design and Simulation
• Multiphysics simulation
• Flow, sensor and actuator simulation
• CAD design, software masks and hardmasks
Prototyping and Fabrication
• Photolithography, soft-lithography (feature resolutions of 1 micron)
• Photoresist, elastomer & epoxy molding
• 3D CNC Micromilling & Microdrilling
• 3D Printing
• Hot embossing
• Laser cutting
• Xurography
• Lamination
• Solvent & Plasma bonding
• Chemical & physical surface wettability modification
• Micro/Nano structuring of surfaces
• Picoliter spotting
Materials
• Silicon, glass
• Elastomers (PDMS, Ecoflex, Flexdym)
• Thermoplastics (PMMA, PET, PS, COC)
• Metals
• Ceramics
• Epoxy glues
Characterization
• Microscopy (optical, SEM, AFM)
• Bioimaging, optical imaging
• Topography/roughness measurements
• Contact angle
• Magnetic, optical, thermal and electrical.
OUR EQUIPMENT
- Spin coater Laurell WS-650-23NPP
- Hydraulic lamination hot press MTIKorea 25T
- MEMERT Ovens
- incubator Scientific Heratherm
- O2 plasma cleaner Harrick Plasma PDC-002CE
- UVO cleaner Jelight 144AX-220
- Corona discharge system Electro-Technic BD-20
- Syringe pumps (microfluidcs, high pressure and double direction)
- Hot plate HP30A Torrey Pines Scientific
- Bioanalytical
The lab supports assay development and testing of bioanalytes (e.g. nucleic acids, proteins, cells, toxins) in biosensors and platforms developed in-house, integrating microfluidic devices with sensors, actuators and electronics. Data measurement and metering are conducted with data acquisition stations, optical/fluorescence microscopy, and image acquisition systems.
Samples are metered/manipulated using pipettes (down to picoliters), microarraying, refrigerated centrifuges, incubators, mixers, and pH meters, as well as custom platforms.
Biochemical assays include thermal cyclers for nucleic acid amplification and an electrophoresis system.
We also have a class 2 biological safety cabinet, autoclave/UV equipment for supplies sterilization. Sample and reagent storage include standard fridge/freezer and an -80°C freezer.
OUR EQUIPMENT
- Non-contact microarray printer GeSiM Nano-Plotter NP2.1
- Syringe pumps NE-300 - New Era Pump Systems
- Microscopes: Leica DMLM, Olympus CKX41, Nikon Eclipse LV100ND
- Stereo Microscope SFC-11C N2GG - Motic®
- Thermal cyclers: Techne Prime - Bibby Scientific, Ristretto - VWR®
- kuroGEL Mini Plus 10 Electrophoresis Horizontal - VWR®
- Stratalinker UV 1800 Crosslinker - Stratagene
- Refrigerated Micro Centrifuge 1730R - Gyrozen
- Incubator IGS60 Heratherm - Thermo Scientific
- Compact Hotplate KW-4AH - Chemat Technology
- Autoclave Sterilizer SA-202 Automatic - Sturdy Industrial
- Class 2 cabinet Scanlaf Mars - Labogene
- Ultra-Low Temperature Freezer DW-HL528HC - Zhongke Meiling Cryogenics
- Micromachining
The micromachining infrastructure specializes in a diverse array of fabrication and material processing techniques. Together, these techniques enable comprehensive micro-scale fabrication and prototyping.
It offers CNC milling for precision subtractive machining of component manufacturing and advanced surface preparation through grinding and polishing for various materials.
The lab supports precise laser cutting for custom designs, xurography for cutting thin films and sheets along with mechanical drilling for creating fine features. 3D printing provides additive manufacturing capabilities, enabling the creation of complex three-dimensional structures.
Additional techniques include, heat press transfer for applying coatings, screen printing for patterning materials and high shear mixing for preparing uniform material dispersions.
OUR EQUIPMENT
- Milling MiniTech 3D CNC
- Milling Supertech 3D CNC
- Grinder/Polisher Buehler EcoMet 250
- Laser cutter Flux Beambox
- Table driller BT-BD 501 - Einhell
- Xurography Silhouette Curio
- Heat press transfer Transmatic REV 3S
- Screen Printer Miniprint MP3040
- High Shear Mixer Silverson L5T
- 3D Printer S3 - Ultimaker
- Microelectronics
Technologies for post-processing of devices, from wafer level to encapsulation of individual chips. Moreover, the ASIC group focuses on developing architectures, circuits and signal processing algorithms for interfacing a variety of sensors produced in-house. In this scope INES MN is part of the INESC Lisbon Electronics Lab, where a variety of high precision IC characterization tools are available.
OUR EQUIPMENT
- Diamond saw dicer Disco DAD 321
- Wire bonding Kulicke & Soffa 4123
- Automatic wire bonding ASM ABS59A
- Spectrum analyzer (100 Hz - 32GHz/18GHz-325GHz) MS282A - Anritsu
- Baseband signal analyzer FMU 36 - R&S
- Signal generator (100KHz-12.7GHz) SMB 100A - R&S
- Vector network analyzer (10 MHz - 24GHz) ZVA 24 - R&S
- Lock-in amplifier SR844 - SRS
- Spectrum analyzer (DC-8GHz) RSA3308A - Tektronix
- Thermal camera 146 I9EQ0109 Guide PC210
- X-ray machine SEAMARK X 5600
- CTI
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OUR EQUIPMENT
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- Microfluidics Lab
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OUR EQUIPMENT
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- Biolab
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OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
- Bioengineering
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dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
- Optical Characterization
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Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum
dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
- Magnetic Characterization
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum
dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
- MEMS Characterization
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Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum
dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
- Material Characterization
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat. Lorem ipsum
dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
OUR EQUIPMENT
- Grinder/Polisher - Bruehler EcoMet 250 +info
- Automatic dicing saw - Disco DAD 321 +info
- Extrusion based 3D printing – FDM system +info
- Magnetic annealing setup +info
- Milling - MiniTech and Supertech 3D CNC System +info
- Plasma Cleaner - PDC-002CE Harrick Plasma +info
- UVO-cleaner - Model 144AX series, Jelight +info
- Vapor Prime Oven - Yield Engineering YES 15 HMDS +info
- Wire Bonding System - Kulicke & Soffa +info
- Wet Benches +info
Characterization
Our labs are equipped with a variety of characterization tools, from material deposition levels to microfabricated devices, supporting quality control of microfabrication processes as well as qualification of materials and devices for both fundamental research and industrial applications.
OUR EQUIPMENT
- Profilometer Dektak-XT Advanced system
- Profilometer (Tencor Alpha-step 200)
- Ellipsometer Semilab SE-2000
- SEM RAITH 150
- Resistivity mapper CMT-SR2000N - AIT
- VSM DMS880
- VSM Microsense EZ7
- X-ray difractometer Siemens D5000
- Magnetoresistance measurement setups: 150Oe, 2KOe probers and Autoprober
- Noise spectrum analyzer
- Vacuum annealing oven with magnetic field
Micromachining
The micromachining infrastructure specializes in a diverse array of fabrication and material processing techniques. Together, these techniques enable comprehensive micro-scale fabrication and prototyping.
It offers CNC milling for precision subtractive machining of component manufacturing and advanced surface preparation through grinding and polishing for various materials.
The lab supports precise laser cutting for custom designs, xurography for cutting thin films and sheets along with mechanical drilling for creating fine features. 3D printing provides additive manufacturing capabilities, enabling the creation of complex three-dimensional structures.
Additional techniques include, heat press transfer for applying coatings, screen printing for patterning materials and high shear mixing for preparing uniform material dispersions.
OUR EQUIPMENT
- Milling MiniTech 3D CNC
- Milling Supertech 3D CNC
- Grinder/Polisher Buehler EcoMet 250
- Laser cutter Flux Beambox
- Table driller BT-BD 501 - Einhell
- Xurography Silhouette Curio
- Heat press transfer Transmatic REV 3S
- Screen Printer Miniprint MP3040
- High Shear Mixer Silverson L5T
- 3D Printer S3 - Ultimaker
Microfluidics
The microfluidics lab focuses its activities in the design, simulation, fabrication and test of microfluidic devices and organs-on-chip, including heterogeneous integration (different materials and thin film sensors/actuators microfabricated in-house).
Design and Simulation
• Multiphysics simulation
• Flow, sensor and actuator simulation
• CAD design, software masks and hardmasks
Prototyping and Fabrication
• Photolithography, soft-lithography (feature resolutions of 1 micron)
• Photoresist, elastomer & epoxy molding
• 3D CNC Micromilling & Microdrilling
• 3D Printing
• Hot embossing
• Laser cutting
• Xurography
• Lamination
• Solvent & Plasma bonding
• Chemical & physical surface wettability modification
• Micro/Nano structuring of surfaces
• Picoliter spotting
Materials
• Silicon, glass
• Elastomers (PDMS, Ecoflex, Flexdym)
• Thermoplastics (PMMA, PET, PS, COC)
• Metals
• Ceramics
• Epoxy glues
Characterization
• Microscopy (optical, SEM, AFM)
• Bioimaging, optical imaging
• Topography/roughness measurements
• Contact angle
• Magnetic, optical, thermal and electrical.
OUR EQUIPMENT
- Spin coater Laurell WS-650-23NPP
- Hydraulic lamination hot press MTIKorea 25T
- MEMERT Ovens
- incubator Scientific Heratherm
- O2 plasma cleaner Harrick Plasma PDC-002CE
- UVO cleaner Jelight 144AX-220
- Corona discharge system Electro-Technic BD-20
- Syringe pumps (microfluidcs, high pressure and double direction)
- Hot plate HP30A Torrey Pines Scientific
Bioanalytical
The lab supports assay development and testing of bioanalytes (e.g. nucleic acids, proteins, cells, toxins) in biosensors and platforms developed in-house, integrating microfluidic devices with sensors, actuators and electronics. Data measurement and metering are conducted with data acquisition stations, optical/fluorescence microscopy, and image acquisition systems.
Samples are metered/manipulated using pipettes (down to picoliters), microarraying, refrigerated centrifuges, incubators, mixers, and pH meters, as well as custom platforms.
Biochemical assays include thermal cyclers for nucleic acid amplification and an electrophoresis system.
We also have a class 2 biological safety cabinet, autoclave/UV equipment for supplies sterilization. Sample and reagent storage include standard fridge/freezer and an -80°C freezer.
OUR EQUIPMENT
- Non-contact microarray printer GeSiM Nano-Plotter NP2.1
- Syringe pumps NE-300 - New Era Pump Systems
- Microscopes: Leica DMLM, Olympus CKX41, Nikon Eclipse LV100ND
- Stereo Microscope SFC-11C N2GG - Motic®
- Thermal cyclers: Techne Prime - Bibby Scientific, Ristretto - VWR®
- kuroGEL Mini Plus 10 Electrophoresis Horizontal - VWR®
- Stratalinker UV 1800 Crosslinker - Stratagene
- Refrigerated Micro Centrifuge 1730R - Gyrozen
- Incubator IGS60 Heratherm - Thermo Scientific
- Compact Hotplate KW-4AH - Chemat Technology
- Autoclave Sterilizer SA-202 Automatic - Sturdy Industrial
- Class 2 cabinet Scanlaf Mars - Labogene
- Ultra-Low Temperature Freezer DW-HL528HC - Zhongke Meiling Cryogenics
Microelectronics
Technologies for post-processing of devices, from wafer level to encapsulation of individual chips. Moreover, the ASIC group focuses on developing architectures, circuits and signal processing algorithms for interfacing a variety of sensors produced in-house. In this scope INES MN is part of the INESC Lisbon Electronics Lab, where a variety of high precision IC characterization tools are available.
OUR EQUIPMENT
- Diamond saw dicer Disco DAD 321
- Wire bonding Kulicke & Soffa 4123
- Automatic wire bonding ASM ABS59A
- Spectrum analyzer (100 Hz - 32GHz/18GHz-325GHz) MS282A - Anritsu
- Baseband signal analyzer FMU 36 - R&S
- Signal generator (100KHz-12.7GHz) SMB 100A - R&S
- Vector network analyzer (10 MHz - 24GHz) ZVA 24 - R&S
- Lock-in amplifier SR844 - SRS
- Spectrum analyzer (DC-8GHz) RSA3308A - Tektronix
- Thermal camera 146 I9EQ0109 Guide PC210
- X-ray machine SEAMARK X 5600
Photonics & Optoelectronics
The optoelectronics lab is equipped for optoelectronic and micromechanical device characterization: a 500 MHz scalar network analyzer, a 1 GHz spectral analyzer, a 2-phase 100 kHz lock-in amplifier and two 1-phase 100 kHz lock-in amplifiers.
We have two picoammeters for low-speed, high sensitivity measurements. The lab also has a monochromator with reticles for 400-1600 nm optical measurements, a tungsten halogen and an arc-lamp light source.
The lab has optical tables, a large assortment of power supplies and optical accessories. Measurements can be performed in vacuum or at controlled pressures.
In the photonics lab we perform forward and inverse photonic design based on finite-difference time-domain and frequency-domain solvers to support the micro and nanofabrication of photonic devices, in particular, metasurfaces. The structured light laboratory enables device characterization (modal analysis decomposition of the shaped optical beams), comprising laser sources (visible and near-infrared), a reprogrammable spatial light modulator, cameras for beam detection, and a variety of optical and optomechanics components.
OUR EQUIPMENT
- Lock-in amplifiers 5209 EG&G Pricenton Applied Research
- Lock-in amplifier SR830 DSP Stanford Research System
- Picoammeters Keithley 237 & 487
- Monochromator Oriel 77250
- 500MHz network analyzer, 4195A Hewlett Packard
- GHz spectral analyzer N9320B - Agilent
Microfluidics Lab
The microfluidics lab focuses its activities in the design, simulation, fabrication and test of microfluidic devices and organs-on-chip, including heterogeneous integration (different materials and thin film sensors/actuators microfabricated in-house).
Design and Simulation
Prototyping and Fabrication
Characterization
Materials
- Design and Simulation
- Multiphysics simulation
- Flow, sensor and actuator simulation
- CAD design, software masks and hardmasks
- Prototyping and Fabrication
- Photolithography, soft-lithography (feature resolutions of 1 micron)
- Photoresist, elastomer & epoxy molding
- 3D CNC Micromilling & Microdrilling
- 3D Printing
- Hot embossing
- Laser cutting
- Xurography
- Lamination
- Solvent & Plasma bonding
- Chemical & physical surface wettability modification
- Micro/Nano structuring of surfaces
- Picoliter spotting
- Materials
- Silicon, glass
- Elastomers (PDMS, Ecoflex, Flexdym)
- Thermoplastics (PMMA, PET, PS, COC)
- Metals
- Ceramics
- Epoxy glues
- Characterization
- Microscopy (optical, SEM, AFM)
- Bioimaging, optical imaging
- Topography/roughness measurements
- Contact angle
- Magnetic, optical, thermal and electrical
OUR EQUIPMENT
- Spin coater Laurell WS-650-23NPP
- Hydraulic lamination hot press MTIKorea 25T
- MEMERT Ovens
- incubator Scientific Heratherm
- O2 plasma cleaner Harrick Plasma PDC-002CE
- UVO cleaner Jelight 144AX-220
- Corona discharge system Electro-Technic BD-20
- Syringe pumps (microfluidcs, high pressure and double direction)
- Hot plate HP30A Torrey Pines Scientific
Design and Simulation
- Multiphysics simulation
- Flow, sensor and actuator simulation
- CAD design, software masks and hardmasks
Prototyping and Fabrication
- Photolithography, soft-lithography (feature resolutions of 1 micron)
- Photoresist, elastomer & epoxy molding
- 3D CNC Micromilling & Microdrilling
- 3D Printing
- Hot embossing
- Laser cutting
- Xurography
- Lamination
- Solvent & Plasma bonding
- Chemical & physical surface wettability modification
- Micro/Nano structuring of surfaces
- Picoliter spotting
Materials
- Silicon, glass
- Elastomers (PDMS, Ecoflex, Flexdym)
- Thermoplastics (PMMA, PET, PS, COC)
- Metals
- Ceramics
- Epoxy glues
Characterization
- Microscopy (optical, SEM, AFM)
- Bioimaging, optical imaging
- Topography/roughness measurements
- Contact angle
- Magnetic, optical, thermal and electrical.
OUR EQUIPMENT
- Spin coater Laurell WS-650-23NPP
- Hydraulic lamination hot press MTIKorea 25T
- MEMERT Ovens
- incubator Scientific Heratherm
- O2 plasma cleaner Harrick Plasma PDC-002CE
- UVO cleaner Jelight 144AX-220
- Corona discharge system Electro-Technic BD-20
- Syringe pumps (microfluidcs, high pressure and double direction)
- Hot plate HP30A Torrey Pines Scientific
