INESC MN offers services to Portuguese and International academic and industry partners through collaborative research, contract research, prototyping and consulting.
INESC MN is a member of the NFFA – Europe Research Infrastructure and EuroNanoLab networks, providing open-access to resources and advanced facilities to users from both Academia and Industry to carry out multidisciplinary research at the nano and microscale.
For more information on capabilities, tools catalogue and user access application please consult the networks website.
INESC MN provides micro and nanofabrication services, from design and simulation to single level and integrated processing, towards microelectronic devices and systems. For a more comprehensive overview of our technologies and equipment check the Facilities menu.
• Advanced material development and thin film deposition from our suit of deposition systems (ion beam sputtering, magnetron sputtering and PECVD), including more than 29 sputter targets available simultaneously in the sputtering machines. Thin film thickness from 0.3 nm to several micrometers are possible with good uniformities across (up to) 200 mm wafers. Several substrates sizes, thickness and type are possible (e.g. glass, silicon, flexible coatings).
• Lithography: consultation and design of masks, mask conversion and test exposure of the pattern in resist coated substrate of choice, using our photo and e-beam lithography systems.
• Patterning: wet and dry etch solutions for selective removal of materials.
• Packaging: services for post-processing of devices, from wafer dicing and polishing to wire bonding and encapsulation of individual chips.
• Characterization services from material deposition level to microfabricated devices: optoelectronic, micromechanical, material structure characterization, magnetic and electrical characterization, profilometry and ellipsometry.
INESC MN has a successful track record as a service provider and partner on development contracts with national and international companies, from collaborative design to microfabrication of devices (e.g. sensors) tailored to the unique requirements of each project.
Collaborations cover pre-production phases from development activities and microfabrication of small series of sensors for qualification, supported by rigorous quality control schemes and technical documentation.
INESC MN’s facilities are equipped to handle the production of small batches of wafers (up to 200 mm diameter), allowing thorough testing of process robustness and ensuring that the manufacturing techniques can be scaled up, facilitating the technology transfer to industrial production.
INESC MN is open for partnerships with start-ups and entrepreneurs to accelerate their innovation endeavors through:
• Access to INESC MN laboratories, cleanroom and equipment.
• Access to our research and technology expertise, through technical consultancy and knowledge transfer.
• Design, engineering and prototyping services.
• Facilitate contacts within the R&D, innovation and industry networks in which INESC MN collaborates.
Types of Users
• Foreign Companies (FC): companies which are not based in Portugal or have subsidiaries in Portugal.
• Foreign Universites (FU): universities or non-profit research institutes which are not located in Portugal.
• National Companies (NC): companies or research centres affiliated with companies which are located in Portugal.
• National Universities (NU): universities, national laboratories or non-profit research institutes located in Portugal.
Project partners, collaborators, members of consortium: these are groups with whom we have common projects, have bilateral collaborations or are members of the INESC MN consortium.
Calculation of Costs
The factors which contribute to the cost of using a particular piece of equipment are as follows:
• Capital investment (I): This is the cost of a piece of equipment, depreciated over 10 years.
• Maintenance (M): This is the yearly cost of maintaining the equipment including periodic technical intervention by trained technicians, consumable parts, gas, water and electricity consumption.
• Cleanroom support (CS): This cost is associated with the cost of the cleanroom including depreciation, maintenance, consumable materials and regular services such as garment cleaning and waste disposal. This cost is added only to equipment located inside the cleanroom or in the grey area.
• House nitrogen (N): This is the cost associated with the use of house nitrogen. The machines are weighted according to their relative use of nitrogen during processing. This cost is not added to the rates quoted for equipment which do not use nitrogen.
In the calculation of the price of equipment use for the different types of users, the difference comes from the amount of the capital depreciation which is charged. National universities are not charged the depreciation costs whereas international companies are charged the full depreciation cost (international universities and national companies are charged a fraction of this cost). The other costs associated with equipment use are charged equally for all types of users.
Table of Prices:
These rates are for equipment use only and does not include materials such as silicon wafers or substrates. This should be supplied by the user or arranged separately.
These rates also do not include the cost of labor if an INESC MN technical staff member is involved in the operation of the machines. Process and packaging equipment must be operated by INESC MN personnel. Characterization equipment can be operated by the users after they have been trained and approved for operation on the specific system by INESC MN personnel.
Please use the filters for a more accurate price consultation.
| Process Equipment | FC | FU | NC | NU |
|---|---|---|---|---|
| Nordiko 3000 | 960 | 680 | 544 | 400 |
| Process Equipment | FC | FU | NC | NU |
|---|---|---|---|---|
| Nordiko 7000 | 139 | 92 | 68 | 45 |
| LAM Rainbow | 155 | 103 | 77 | 51 |
| Oxford Plasma Pro PECVD | 114 | 82 | 67 | 51 |
| SPTS ICP/RIE | 144 | 100 | 78 | 56 |
| HIMT DWLii | 117 | 82 | 64 | 47 |
| RAITH 150 e-Beam | 185 | 118 | 85 | 52 |
| Suss MA/BA 6 Mask Aligner | 100 | 74 | 60 | 47 |
| SVG coater/developer | 100 | 73 | 60 | 46 |
| HDMS vapor prime oven | 85 | 64 | 53 | 43 |
| Nordiko 2000 | 117 | 81 | 63 | 45 |
| Nordiko 3000 | 120 | 85 | 68 | 50 |
| Nordiko 3600 | 154 | 102 | 76 | 50 |
| Nordiko 8800 | 171 | 123 | 100 | 76 |
| Alcatel multitarget | 89 | 64 | 52 | 40 |
| Semitool wafer washer | 32 | 31 | 30 | 29 |
| PVA Asher | 111 | 88 | 77 | 65 |
| UHV-Sputtering | 81 | 60 | 50 | 40 |
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