The 22nd Meeting of the International Association for Transport Properties, held on June 23rd in Boulder, Colorado, USA, featured a presentation on the work by Dr. Vania Silverio on “Challenges in the Thermal Management of Electronic Devices“.

The presentation highlighted the increasing challenges faced by engineers and researchers in developing efficient thermal management solutions for electronic devices. The rise of portable electronics and increased computational power has led to increased heat generation, which can result in reduced performance, reliability, and lifespan of devices.

Dr. Silverio’s research focuses on identifying and addressing the key challenges in thermal management, including the development of more effective heat sinks, improved thermal interfaces, and advanced cooling technologies. The team has made significant progress in developing novel materials and designs that can efficiently dissipate heat from high-power electronic components. The work is expected to have a significant impact on the development of more reliable and efficient electronic devices in various industries, including consumer electronics, aerospace, and automotive.