The SPIN-CHIP project, funded by the Chips Joint Undertaking and coordinated by Thales, officially held its kick-off meeting in Paris on 2–3 June 2026, bringing together industrial partners, SMEs, research organizations, and academia across Europe.

The project focuses on Magnetic Tunnel Junctions (MTJs) for next-generation “Made in EU” semiconductor technologies, aiming to improve energy efficiency, speed, sensitivity, and cost-effectiveness across memory, artificial intelligence, sensor, and RF applications. It also aims to demonstrate the value of spintronics in addressing key challenges in European microelectronics and to accelerate the development and commercialization of these technologies through their integration into CHIPS JU Pilot Lines, fostering a more competitive and resilient European semiconductor ecosystem.

INESC MN co-leads the Sensors Work Package with Infineon and coordinates the Portuguese consortium, which includes BeyondVision, International Iberian Nanotechnology Laboratory, and CardioID.

The kick-off meeting marked the start of project activities and provided an opportunity to align technical objectives, collaboration strategies, and the roadmap for the coming years.