INESC MN is a member of The Microelectronics Agenda Consortium, within the mobilizing agendas of the Recovery and Resilience Plan (Plano de Recuperação e Resiliência – PRR). The Agenda main goal is to strengthen the production and innovation capacity of the national semiconductor and microelectronics industry.

INESC MN is applying its know-how in microfabrication targeting the industrialization of processes for integrated optical circuits in collaboration with Picadvanced.

Today we were reducing the thickness of a 3″ wafer from 388 microns to 250 microns using Etch KOH.