At INESC MN we specialize in microfabrication of devices in 200 mm wafers, including integration with CMOS architectures. Full process from bare wafers to finished devices for pre-production stage, or single level processing, are available.

• Thin Film Deposition: advanced materials development and magnetic multilayer engineering using ion beam and magnetron sputtering tools, with excellent uniformity and film growth control across 200 mm wafers.

• Lithography: direct write laser and electron beam lithography for design optimization and mask aligner for large batch wafer production. Custom mask design for all lithography tools.

• Patterning: ion beam milling for highly controlled and precise thin film etching and ICP reactive ion etching for highly selective material removal processes. Dry ashing of wafer batches for resist removal.

• Characterization: qualification from unpatterned thin film material level to microfabricated devices:
– Vibrating Sample Magnetometry for bulk magnetic measurements and X-ray diffractometry for structural analysis.
– Electric characterization through measurements of 2 and 4 probes, with application of an external magnetic field in any direction.
– Resistivity mapper for material quality and uniformity control.
– Optical and scan electron microscopy, profilometry and ellipsometry for process quality control.

• Post-processing device packaging: supply of wafer level or diced, wirebonded individual chips.